DIP400mil
总类: 无总类游戏内容Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. NFME offers DIP400mil with lead counts 28&32, the lead pitch is 1.778mm (70mil), that are SDIP type.
Application
Dual-in-line packages are considered one of the most established industry standard packages. DIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.
Features
* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound
Design Rule
Minimum Ink Size: 20l (500) diameter or non-ink with wafer mapping
Maximum Ink Height: 1mil(25um)
Minimum Sawing street width: 2.4 (60um)
Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.
Pkg type | Pkg size | Wafer thickness |
SDIP | All | 10~16.8 mil (250~420 um) |
Wire Bond Rule
Wire size | Min. bond pad pitch | Min. bond pad opening | Wire loop control | |
50um (2.0mil) | 200 um | 150 um |
Max. wire length loop height |
5000um <400um |
38um (1.5mil) | 170 um | 100um |
Max. wire length loop height |
5000um <400um |
33 um (1.3mil) | 150 um | 90 um |
Max. wire length loop height |
5000um <400um |
30 um (1.2mil) | 150um | 90 um |
Max. wire length loop height |
5000um <400um |
25um (1.0mil) | 70um | 60um |
Max. wire length loop height |
5000um <400um |
23um (0.9mil) | 60 um | 50um |
Max. wire length loop height |
3000um <400um |
20 um (0.8mil) | 60 um | 50 um |
Max. wire length loop height |
3000um <400um |
Package Outline
PKG TYPE | Lead count | Lead Pitch | Lead Width | LeadThickness | BD | POD |
SDIP | 28 | 1.778 | 0.46 | 0.25 | DOWN | DOWN |
SDIP | 32 | 1.778 | 0.46 | 0.25 | DOWN | DOWN |
Packing & Shipping(Tube)
SDIP |
|||
PKG TYPE | Lead count | QTY/Tube | Tube/Inner Box |
SDIP | 28 | 18 | 35 |
SDIP | 32 | 17 | 35 |
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