Production Overview

Plastic Shrink Small Outline packaging (SSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SSOP165mil with 8lead counts. The lead pitch is 1.778mm.

Application

Shrink Small Outline packages are considered one of the most established industry standard packages. SSOP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

Features

* JEDEC standard compliant or reference * Wide choice of pad sizes to meet die size per customer lead frame design capability * Pb-free process ready and Green Molding Compound

Design Rule

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

Maximum Ink Height: 1mil(25um)

Minimum Sawing street width: 2.4mil (60um)

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

Pkg type		Pkg size	Wafer thickness
SSOP165mil		All	10~12 mil (250~300 um)

 

Wire Bond Rule

Wire size	Min. bond pad pitch	Min. bond pad opening	Wire loop control
50um (2.0mil)	200 um	150 um	Max. wire length loop height	5000um <300um
38um (1.5mil)	170 um	100um	Max. wire length loop height	5000um <300um
33 um (1.3mil)	150 um	90 um	Max. wire length loop height	5000um <300um
30 um (1.2mil)	150um	90 um	Max. wire length loop height	5000um <300um
25um (1.0mil)	70um	60um	Max. wire length loop height	5000um <300um
23um (0.9mil)	60 um	50um	Max. wire length loop height	3000um <300um
20 um (0.8mil)	60 um	50 um	Max. wire length loop height	3000um <300um

Package Outline

DIP/SkDIP/SDIP/HDIP (All units are in mm)

PKG TYPE	Lead count	Lead Pitch	Lead Width	LeadThickness	BD	POD
SSOP	8	1.778	0.46	0.25	DOWN	DOWN

Packing & Shipping

SSOP(Tube)

PKG TYPE	Lead count	QTY/Tube	Tube/Inner Box
SSOP	8	80	200