电机无磁护环
FCCSPFCLGA Series
产品介绍
Production Overview
TFME offers various FCCSP and FCLGA package based on customer different requirement.Features
- SiP (FC + SMT + Wire bond) available. - CUF, MUF available. - 7N/12N/14N/16N wafer node mass production - Various substrate technology qualified including SAP, MSAP, ETS, MIS and SLP. - Fully Turnkey for wafer bumping, probing, assembly, FT available.Process Capability & Design Rule
Reliability Test Standards
Item | Test Condition | Test Method | Test Period |
Pre-condition | Ta-30℃/RH-60% | J-STD-020 JESD22-A113 | MSL3 |
Temperature cycling (T/C) | TL=-65℃/15min TH=150°C/15min | JESD22-A104 | 500 cycle/1000 cycle |
Temperature & Humidity Storage (THS) | Ta=85℃ RH=85% | JESD22-A101 | 500 hours/1000 hours |
High temperature storage(HTS) | Ta=150℃ | JESD22-A103 | 500 hours/1000 hours |
uHAST | 130℃/85%RH | JESD22-A118 | 96 hours/ 192 hours |
Shipment Packing
FCCSP | Tray |
Tape & Reel | |
FCLGA | Tray |
Tape & Reel |
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