Production Overview

TFME offers various FCCSP and FCLGA package based on customer different requirement.    

Features

- SiP (FC + SMT + Wire bond) available. - CUF, MUF available. - 7N/12N/14N/16N wafer node mass production - Various substrate technology qualified including SAP, MSAP, ETS, MIS and SLP. - Fully Turnkey for wafer bumping, probing, assembly, FT available.  

Process Capability & Design Rule

 

 

Reliability Test Standards

Item	Test Condition	Test Method	Test Period
Pre-condition	Ta-30℃/RH-60%	J-STD-020 JESD22-A113	MSL3
Temperature cycling (T/C)	TL=-65℃/15min TH=150°C/15min	JESD22-A104	500 cycle/1000 cycle
Temperature & Humidity Storage (THS)	Ta=85℃ RH=85%	JESD22-A101	500 hours/1000 hours
High temperature storage(HTS)	Ta=150℃	JESD22-A103	500 hours/1000 hours
uHAST	130℃/85%RH	JESD22-A118	96 hours/ 192 hours

 

Shipment Packing

FCCSP	Tray
	Tape & Reel
FCLGA	Tray
	Tape & Reel