boyu博鱼中国官方网站

搜索
产品中心

FCBGAFCLGA Series

分类整理管理: 无分类整理管理信息
新产品资询固定电话:13569136654
关键词:无分类整理资源FCBGAFCLGA Series
FCBGAFCLGA Series
产品介绍

FCBGAFCLGA Series

Production Overview

Flip Chip interconnection, also knownas Controlled Collapse Chip Connection, C4, has been identified as a high performance packaging solution to meet the growing need for products with increased electrical performance, high I/O, and high system reliability as a replacement for conventional wire bond process. Utilizing whole die area as for electrical connection, substrate I/O per unit exponentially increased vs. perimeter wire interconnection technology. Flip chip interconnect also allows direct connection with on-die power planes which enables increased electrical performance including increased switching speed and more efficient power distribution to the IC performance at lower operating voltages. TF-AMD Flip Chip are assembled with single unit laminate which is the highest routing density through build-up technology to maximize the device performance &conventional ceramic substrate for reliability enhanced package solution. Combined with Flip Chip interconnection, TF-AMD provides optimal design flexibility for final package design& product format to fit an end user requirement. TF-AMD offers Flip Chip BGA packages with ball counts up to 3000 & PGA package up to 2000

Application

Flip Chippackage is considered one of the most established industry platform applicable for high pincount and/or high performance ASICs. Large body FC BGA/PGAs provide package solution forComputing (microprocessors / graphic, server), gaming,high bandwidth networking/Communicationdevices. Combined with Flip Chip technology &BGA/PGAlead format, TF-AMD help to enable SMT and also pin insertion application.

Features

Flip Chip BGA/PGA Packaging Package Types: Bare die, Stiffener, Lidded (Top hat & flat top)

FCBGAFCLGA Series

  Wafer Node ³14/16nm ELK(extreme low K) qualified, 7nm in development. Package sizes from 12mm to 55mm (75mm in development) Die area up to 800mm^2 Lead Free, Eutectic, High-Pb bump for Flip Chip connection Passive component size down to 01005 High thermal performance solution using Indium metal TIM   Substrate o 4 – 18 layers laminate build up o Coreless, 0.2mm, 0.4mm, 0.8mm, 1.0mm available o High CTE ceramic / LTCC alumina ceramic o BGA / PGA   Footprints Pitch o BGA : 0.5mm, 0.65mm, 0.8mm and 1.0mm o PGA : 1.0mm, 1.27mm   Other Option o Multi-die capability o Die binning to waffle pack up to 256 BINs  

Flip Chip BGA/PGA Test

Test Product Engineering o TF-AMD test provides a competitive test solution to our customers ranging from test development, platform conversion, and product maintenance and test data analysis. o The team has rich test development experience of various product portfolio, including high-end digital, mix-signal, SOC and high speed products.   Adding Value to Customer o Reduce customer overhead by outsourcing projects / tasks to avoid maintaining a large scale of dedicated team o Incorporate industrial standard through leveraging best known method from our database & continuous cost saving by driving test time reduction, yield improvement.   Service Solutions o Wafer Sort test development o Final Test development o Low cost platform conversion o Multi-site enablement o Burn-in capabilities   Test Development Experience o CPU, APU, GPU o Chipset o Digital Audio o Baseband o Microcontroller o LCD Driver o Touch Panel Driver  

ATE platforms and products

ATE Digital Mix-Signal SOC CPU/GPU
Advantest 93K * * * *
Advantest T2000 * * * *
LTX Sapphire *     *
Teradyne J750 * *    
 

Reliability Test Standards

Reliability Test Reference Standard Test Conditions
Preconditioning JESD22-A113 MSL 3
Preconditioning+Temp Cycling JESD22-A104 0-100℃,3K cycles
Preconditioning+Unbiased HAST JESD22-A118 condition A(85% RH,130C,96hrs)
High Temp Storage JESD22-A103 125C for 1k Hours
 

Design Rule

Top Hat Single Piece Lid

FCBGAFCLGA Series

Lid size=substrate size-0.2mm Standard foot sizes o 2mm for 15-25mm body o 3mm for 27-31mm body o 4mm for 33-50mm body   Max 3mm on all four sides (UF will flow under the bend/slant of the HS). Extended design rule allow Max. 2.5mm for the body size ≤31mm   Lid is centered   Cavity depth for 12inch wafer SPL is 0.8mm and total thickness is 1.3mm o TIM Thickness target: 40um (Max. 100um) o Adhesive Thickness target: 120um (Max. 200um) o Lid manufacturing tolerance: +/-50um   Body size<31mm support bare die structure (without stiffener/lid construction)

Packing & Shipping (in house standard)

 

BGA / PGA (Tray)

PKG TYPE Body Size(mm) QTY/Tray Tray/lnner Box
BGA 19x19 84 6+1(bank)
BGA 23x23 60 10+1(bank)
BGA 24.5x24.5 44 10+1(bank)
BGA 27x27 40 10+1(bank)
BGA 27x31 32 10+1(bank)
BGA 29x32 24 10+1(bank)
BGA 29x37 21 10+1(bank)
BGA 40x40 21 10+1(bank)
BGA 45x45 12 10+1(bank)
BGA 42.5x42.5 12 10+1(bank)
BGA 50x50 10 10+1(bank)
PGA 35X35 18 10+1(bank)
PGA 40x40 12 10+1(bank)
 
上一个
下一个

相关产品

 电机无磁护环
电机无磁护环
 镁合金可溶性桥塞
镁合金可溶性桥塞
可溶桥塞用于直井、水平井的多层压裂作业,采用可溶镁合金和橡胶材料,实现桥塞的完全降解。
 无磁承压喷丸钻杆
无磁承压喷丸钻杆
无磁承压喷丸钻杆
 89-58-3060mm无磁钻杆
89-58-3060mm无磁钻杆
一家从事精密机械制造及零部件加工、装配的企业,集锻造、热处理、机械加工于一体。
 上无磁钻杆(带缆芯)
上无磁钻杆(带缆芯)
一家从事精密机械制造及零部件加工、装配的企业,集锻造、热处理、机械加工于一体。
 下无磁钻杆
下无磁钻杆
一家从事精密机械制造及零部件加工、装配的企业,集锻造、热处理、机械加工于一体。
 89无磁双头螺旋钻杆
89无磁双头螺旋钻杆
一家从事精密机械制造及零部件加工、装配的企业,集锻造、热处理、机械加工于一体。
 矿用随钻轨迹测量仪
矿用随钻轨迹测量仪
执行标准:东北特钢集团有限责任公司新产品技术条件, (签订的无磁订货权)
 采煤机链轮
采煤机链轮
该产品属于一种高技术含量产品(主要瓶颈是:合金材料冶炼,热处理的特殊工艺),目前国内的链轮基本使用寿命是1~4月不等,均出现齿轮牙变形,链轮磨损严重。增加使用方更换维修频次,增大维修更换费用。
 油气井压裂可溶镁合金桥塞
油气井压裂可溶镁合金桥塞
可溶桥塞用于直井、水平井的多层压裂作业,采用可溶镁合金和橡胶材料,实现桥塞的完全降解。
 无磁法兰
无磁法兰
一家从事精密机械制造及零部件加工、装配的企业,集锻造、热处理、机械加工于一体。
 空中受油管
空中受油管
焊前,实心220毫米直径,干完壁厚3mm,几吨材料变102公斤
暂时没有内容信息显示
请先在网站后台添加数据记录。

写成您的信息

WRITE A MESSAGE TO US

留下联系方式技术应用名稱:
客户留言
描叙:

陕西博信高精度营造有效集团公司

地扯:济源市虎岭产业链聚集区区天坛创立公司园A区2号办公楼

邮箱账号:13569136654@126.com

Copyright © 2021 河南省博信细密生产有限品牌英文品牌 著作权法拥有.       美国法律保护已能够ipv6  SEO性子 

博鱼(boyu·中国)官方网站-登录入口星空体育·(StarSky Sports)官方网站博鱼(中国)|官方网站-BOYUSPORTSMILE|米乐·M6(中国大陆)官方网站星空体育(XK Sports)中国官方网站