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FCBGAFCLGA Series
产品介绍
Production Overview
Flip Chip interconnection, also knownas Controlled Collapse Chip Connection, C4, has been identified as a high performance packaging solution to meet the growing need for products with increased electrical performance, high I/O, and high system reliability as a replacement for conventional wire bond process. Utilizing whole die area as for electrical connection, substrate I/O per unit exponentially increased vs. perimeter wire interconnection technology. Flip chip interconnect also allows direct connection with on-die power planes which enables increased electrical performance including increased switching speed and more efficient power distribution to the IC performance at lower operating voltages. TF-AMD Flip Chip are assembled with single unit laminate which is the highest routing density through build-up technology to maximize the device performance &conventional ceramic substrate for reliability enhanced package solution. Combined with Flip Chip interconnection, TF-AMD provides optimal design flexibility for final package design& product format to fit an end user requirement. TF-AMD offers Flip Chip BGA packages with ball counts up to 3000 & PGA package up to 2000Application
Flip Chippackage is considered one of the most established industry platform applicable for high pincount and/or high performance ASICs. Large body FC BGA/PGAs provide package solution forComputing (microprocessors / graphic, server), gaming,high bandwidth networking/Communicationdevices. Combined with Flip Chip technology &BGA/PGAlead format, TF-AMD help to enable SMT and also pin insertion application.Features
Flip Chip BGA/PGA Packaging Package Types: Bare die, Stiffener, Lidded (Top hat & flat top)Wafer Node ³14/16nm ELK(extreme low K) qualified, 7nm in development. Package sizes from 12mm to 55mm (75mm in development) Die area up to 800mm^2 Lead Free, Eutectic, High-Pb bump for Flip Chip connection Passive component size down to 01005 High thermal performance solution using Indium metal TIM Substrate o 4 – 18 layers laminate build up o Coreless, 0.2mm, 0.4mm, 0.8mm, 1.0mm available o High CTE ceramic / LTCC alumina ceramic o BGA / PGA Footprints Pitch o BGA : 0.5mm, 0.65mm, 0.8mm and 1.0mm o PGA : 1.0mm, 1.27mm Other Option o Multi-die capability o Die binning to waffle pack up to 256 BINs
Flip Chip BGA/PGA Test
Test Product Engineering o TF-AMD test provides a competitive test solution to our customers ranging from test development, platform conversion, and product maintenance and test data analysis. o The team has rich test development experience of various product portfolio, including high-end digital, mix-signal, SOC and high speed products. Adding Value to Customer o Reduce customer overhead by outsourcing projects / tasks to avoid maintaining a large scale of dedicated team o Incorporate industrial standard through leveraging best known method from our database & continuous cost saving by driving test time reduction, yield improvement. Service Solutions o Wafer Sort test development o Final Test development o Low cost platform conversion o Multi-site enablement o Burn-in capabilities Test Development Experience o CPU, APU, GPU o Chipset o Digital Audio o Baseband o Microcontroller o LCD Driver o Touch Panel DriverATE platforms and products
ATE | Digital | Mix-Signal | SOC | CPU/GPU |
Advantest 93K | * | * | * | * |
Advantest T2000 | * | * | * | * |
LTX Sapphire | * | * | ||
Teradyne J750 | * | * |
Reliability Test Standards
Reliability Test | Reference Standard | Test Conditions |
Preconditioning | JESD22-A113 | MSL 3 |
Preconditioning+Temp Cycling | JESD22-A104 | 0-100℃,3K cycles |
Preconditioning+Unbiased HAST | JESD22-A118 | condition A(85% RH,130C,96hrs) |
High Temp Storage | JESD22-A103 | 125C for 1k Hours |
Design Rule
Top Hat Single Piece Lid
Lid size=substrate size-0.2mm Standard foot sizes o 2mm for 15-25mm body o 3mm for 27-31mm body o 4mm for 33-50mm body Max 3mm on all four sides (UF will flow under the bend/slant of the HS). Extended design rule allow Max. 2.5mm for the body size ≤31mm Lid is centered Cavity depth for 12inch wafer SPL is 0.8mm and total thickness is 1.3mm o TIM Thickness target: 40um (Max. 100um) o Adhesive Thickness target: 120um (Max. 200um) o Lid manufacturing tolerance: +/-50um Body size<31mm support bare die structure (without stiffener/lid construction)
Packing & Shipping (in house standard)
BGA / PGA (Tray)
PKG TYPE | Body Size(mm) | QTY/Tray | Tray/lnner Box |
BGA | 19x19 | 84 | 6+1(bank) |
BGA | 23x23 | 60 | 10+1(bank) |
BGA | 24.5x24.5 | 44 | 10+1(bank) |
BGA | 27x27 | 40 | 10+1(bank) |
BGA | 27x31 | 32 | 10+1(bank) |
BGA | 29x32 | 24 | 10+1(bank) |
BGA | 29x37 | 21 | 10+1(bank) |
BGA | 40x40 | 21 | 10+1(bank) |
BGA | 45x45 | 12 | 10+1(bank) |
BGA | 42.5x42.5 | 12 | 10+1(bank) |
BGA | 50x50 | 10 | 10+1(bank) |
PGA | 35X35 | 18 | 10+1(bank) |
PGA | 40x40 | 12 | 10+1(bank) |
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