电机无磁护环
WLCSP Series
产品介绍
Production Overview
TFME offers various Wafer Level CSP product to customer including Fan in type and Fan out type.
Feature
Fan in WLCSP - Ball count : 2~309 - Structure: 1P1M~ 2P2M - Body size: 0.6*0.3~7.6*7 .6mm - RDL L/S: min.5um/5um Fan out WLCSP - Ball count: 36 ~203 - Structure: 1P1M~3P3M - Body size: max 20*20mm - RDL L/S: min.2um/2umProcess Capability & Design Rule
Fan in WLCSP
Process Capability & Design Rule
Fan out WLCSP
Reliability Test Standards
Item | Test Condition | Test Method | Test Period |
Pre-condition | Ta=85℃/RH=85% or Ta=30℃/RH=60% | J-STD-020 JESD22-A113 | MSL 1 or MSL3 |
Temperature cycling (T/C) | TL--65℃/15min TH=150℃/15min | JESD22-A104 | 500 cycle/1000 cycle |
Temperature & Humidity Storage (THS) | Ta=85℃ RH-85% | JESD22-A101 | 500 hours/1000 hours |
High temperature storage(HTS) | Ta=150℃ | JESD22-A103 | 500 hours/1000 hours |
Pressure cooker temp. (PCT) | Ta=121℃ 2atm | JESD22-A102 | 96 hours/ 168 hours |
uHAST | 130℃/85%RH | JESD22-A118 | 96 hours/192 hours |
Shipment Packing
Fan in WLCSP | Tape & Reel |
Fan out WLCSP | Tape & Reel |
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