Production Overview

TFME offers various Wafer Level CSP product to customer including Fan in type and Fan out type.

Feature

Fan in WLCSP - Ball count : 2~309 - Structure: 1P1M~ 2P2M - Body size: 0.6*0.3~7.6*7 .6mm - RDL L/S: min.5um/5um   Fan out WLCSP - Ball count: 36 ~203 - Structure: 1P1M~3P3M - Body size: max 20*20mm - RDL L/S: min.2um/2um  

Process Capability & Design Rule

Fan in WLCSP

 

Process Capability & Design Rule

Fan out WLCSP

 

Reliability Test Standards

Item	Test Condition	Test Method	Test Period
Pre-condition	Ta=85℃/RH=85% or Ta=30℃/RH=60%	J-STD-020 JESD22-A113	MSL 1 or MSL3
Temperature cycling (T/C)	TL--65℃/15min TH=150℃/15min	JESD22-A104	500 cycle/1000 cycle
Temperature & Humidity Storage (THS)	Ta=85℃ RH-85%	JESD22-A101	500 hours/1000 hours
High temperature storage(HTS)	Ta=150℃	JESD22-A103	500 hours/1000 hours
Pressure cooker temp. (PCT)	Ta=121℃ 2atm	JESD22-A102	96 hours/ 168 hours
uHAST	130℃/85%RH	JESD22-A118	96 hours/192 hours

 

Shipment Packing

Fan in WLCSP	Tape & Reel
Fan out WLCSP	Tape & Reel